PART |
Description |
Maker |
FGA272-638G FGA303-638G FGAX600-638G FGA304-638G F |
272 POS 1.27MM BGA ADAPTER BGA272, IC SOCKET 303 POS 1.27MM BGA ADAPTER BGA303, IC SOCKET 600 POS 1.27MM BGA EXTRACTION ADAPTER BGA600, IC SOCKET 304 POS 1.27MM BGA ADAPTER BGA304, IC SOCKET 168 POS 1.27MM BGA EXTRACTION ADAPTER BGA168, IC SOCKET 304 POS 1.27MM BGA EXTRACTION ADAPTER 255 POS 1.27MM BGA EXTRACTION ADAPTER 357 POS 1.27MM BGA ADAPTER 560 POS 1.27MM BGA ADAPTER
|
Advanced Interconnections, Corp. ADVANCED INTERCONNECTIONS CORP
|
IT3D-300S-BGA TR0636E-20027 |
IT3D(M)-300S-BGA (57) BGA Shearing Force TEST REPORT
|
Hirose Electric
|
FDZ4670 |
N-Channel PowerTrench?MOSFET BGA 30V, 25A, 2.5mΩ N-Channel PowerTrench㈢MOSFET BGA 30V, 25A, 2.5mヘ
|
Fairchild Semiconductor
|
HYRDU64164M-80M HYRDU72184M-80M HYRDU72184M-60M |
4M X 16 RAMBUS, PBGA66 MICRO, BGA-66 4M X 18 RAMBUS, PBGA74 MICRO, BGA-74
|
Hynix Semiconductor, Inc.
|
IBM25PPC740L-GB375A2T IBM25PPC740L-GB375A2R IBM25P |
MICROPROCESSOR|32-BIT|CMOS|BGA|360PIN|CERAMIC MICROPROCESSOR|32-BIT|CMOS|BGA|255PIN|CERAMIC 微处理器| 32位|的CMOS | BGA封装| 255PIN |陶瓷
|
Glenair, Inc. Vishay Semiconductors
|
IBM25PPC740-DB0M2660 IBM25PPC740-EB0M2660 IBM25PPC |
32-BIT, 266 MHz, RISC PROCESSOR, CBGA360 25 X 25 MM, 1.27 MM PITCH, CERAMIC, BGA-360 32-BIT, 233 MHz, RISC PROCESSOR, CBGA360 25 X 25 MM, 1.27 MM PITCH, CERAMIC, BGA-360 32-BIT, 200 MHz, RISC PROCESSOR, CBGA360 25 X 25 MM, 1.27 MM PITCH, CERAMIC, BGA-360 32-BIT, 300 MHz, RISC PROCESSOR, CBGA360 25 X 25 MM, 1.27 MM PITCH, CERAMIC, BGA-360
|
Japan Aviation Electronics Industry, Ltd.
|
K7P401822B-HC16 K7P401822B-HC20 K7P401822B-HC25 K7 |
SENSOR DIFF VACUUM GAGE 10 H2O 128K × 36 128Kx36 & 256Kx18 Synchronous Pipelined SRAM 128K × 36 256K X 18 STANDARD SRAM, 2.7 ns, PBGA119 14 X 22 MM, BGA-119 128K X 36 STANDARD SRAM, 2.7 ns, PBGA119 14 X 22 MM, BGA-119 256K X 18 STANDARD SRAM, 3 ns, PBGA119 14 X 22 MM, BGA-119 SENSOR DIFF VACUUM GAGE 1PSI SENSOR ABSOLUTE 0-15PSIA 128Kx36 & 256Kx18 Synchronous Pipelined SRAM
|
Samsung Semiconductor Co., Ltd. SAMSUNG SEMICONDUCTOR CO. LTD. SAMSUNG[Samsung semiconductor]
|
IBM25PPC405EP-3GA133C IBM25PPC405EP-3GA200C IBM25P |
32-BIT, 133.33 MHz, RISC PROCESSOR, PBGA385 31 X 31 MM, ENHANCED, PLASTIC, BGA-385 32-BIT, 200 MHz, RISC PROCESSOR, PBGA385 31 X 31 MM, ENHANCED, PLASTIC, BGA-385 32-BIT, 266.66 MHz, RISC PROCESSOR, PBGA385 31 X 31 MM, ENHANCED, PLASTIC, BGA-385
|
Electronic Theatre Controls, Inc.
|
N01L1618N1AB2-70I N01L1618N1AB-70I |
64K X 16 STANDARD SRAM, 70 ns, PBGA48 GREEN, BGA-48 64K X 16 STANDARD SRAM, 70 ns, PBGA48 BGA-48
|
ON Semiconductor ST Microelectronics
|
AT49BV160-90CI AT49BV161-70CI AT49BV161-90CI AT49B |
EEPROM|FLASH|1MX16/2MX8|CMOS|BGA|48PIN|PLASTIC EEPROM|FLASH|1MX16/2MX8|CMOS|BGA|45PIN|PLASTIC 的EEPROM | FLASH动画| 1MX16/2MX8 |的CMOS | BGA封装| 45PIN |塑料
|
ATM Electronic, Corp.
|
W9864G2DB-7 |
BGA SDRAM
|
Winbond Electronics
|
GS8322Z72C-225T GS8322Z72GC-225T GS8322Z18B-225IT |
512K X 72 ZBT SRAM, 7 ns, PBGA209 14 X 22 MM, 1 MM PITCH, BGA-209 512K X 72 ZBT SRAM, 7 ns, PBGA209 14 X 22 MM, 1 MM PITCH, ROHS COMPLIANT, BGA-209 2M X 18 ZBT SRAM, 7 ns, PBGA119
|
GSI Technology, Inc.
|
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